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revisions ltr description date (yr - mo - da) approved a changed the maximum operating supply current and enable supply current parameters of table i for radiation level . ksr . 9 8 -10-02 raymond monnin b removed references to device class m. updated document to reflect current mil - prf - 38535 requirements . glg 13-08-21 charles f. saffle rev sheet rev b b b b b sheet 15 16 17 18 19 rev status rev b b b b b b b b b b b b b b of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by jeff bowling dla land and maritime standard microcircuit drawing checked by jeff bowling columbus, ohio 4321 8 - 3990 http://www.landandmaritime.dla.mil this drawing is available for use by all approved by raymond monnin microcircuit, memory, digital, cmos /sos, radiation hardened, 64 k x 1 static ram, monolithic silicon departments and agencies of the department of defense drawing approval date 9 7 -10-20 amsc n/a revision level b size a cage code 67268 5962- 9 5822 sheet 1 of 19 dscc form 2233 apr 97 5962- e 476- 13
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents two product assurance class levels consisting of high reliability (device class q ) and space application (device class v). a choice of case outlines and lead finishes are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness assurance (rha) levels are reflected in the pin. 1.2 pin . the pin is as shown in the following example: 5962 f 9 5822 01 q x c federal rha device device case lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \ / drawing number 1.2.1 rha designator . device classes q and v rha marked devices meet the mil - prf - 38535 specified rha levels and are marked with the appropriate rha designator. a dash ( - ) indicates a non- rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number 1 / circuit function access time 01 6564 3arh 64 k x 1 radiation hardened cmos/sos sram 50 ns 1.2.3 device class designator . th e device class designator is a single letter identifying the product assurance level as follows: device class device requirements documentation q or v certification and qualification to mil - prf -38535 1.2.4 case outline(s) . the case outline(s) are as designated in mil - std - 1835 and as follows: outline letter descriptive designator terminals package style x see figure 1 2 4 flat pack 1.2.5 lead finish . the lead finish is as specified in mil - prf - 38535 for device classes q and v . 1.3 absolute maximum ratings . 2 / supply voltage range ................................................................. - 0.5 v to +7.0 v dc input, output, or i/o voltage ....................................................... - 0.3 v dc to v dd +0.3 v dc maximum package power dissipation (p d ) at t a = +125
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 3 dscc form 2234 apr 97 1.4 recommended operating conditions . supply voltage (v dd ) .................................................................. +4.5 v dc to +5.5 v dc ground voltage (gnd) ............................................................... 0.0 v dc input high voltage (v ih ) .............................................................. 0.8v dd to v dd input low voltage (v il ) ............................................................... 0.0 v dc to 0.2v dd case operating temperature range (t c ) ..................................... -55
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 4 dscc form 2234 apr 97 jedec international (jedec) jesd 78 - ic latch- up test. (applications for copies should be addressed to jedec solid state technology association, 3103 north 10 th street, suite 240- s, arlington, va 22201- 2107; http://www.jedec.org .) (non - government standards and other publications are normally available from the organizati ons that prepare or distribute the documents. these documents also may be available in or through libraries or other informational services.) 2.3 order of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item requirements for device classes q and v shall be in accordance with mil - prf - 38535 and as specified herein or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as describ ed herein. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil - prf - 38535 and herein for device classes q and v. 3.2.1 case outline(s) . the case outline(s) shall be in acc ordance with 1.2.4 herein. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 1. 3.2.3 truth table(s) . the truth table shall be as specified on figure 2. 3.2. 4 radiation exposure circuit . the radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.2.5 functional tests . functional tests used to test this device shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing or acquiring activity upon request. for device classes q and v alternate test patterns shall be under the control of the device manufacturer's technolo gy review board (trb) in accordance with mil - prf - 38535 and shall be made available to the preparing or acquiring activity upon request. 3.3 electrical performance characteristics and postirradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table i and shall apply over the full case operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table iia. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's pin may also be marked. for packages where marki ng of the entire smd pin number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962 - " on the device. for rha product using this option, the rha designator shall still be marked. marking for device classes q and v shall be in accordance with mil - prf - 38535. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil - prf -38535. 3.6 certificate of compliance . for device classes q and v, a certificate of compliance shall be required from a qml - 38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). the certificate of compliance submitted to dla land and maritime - va prior to listing as an appro ved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes q and v, the requirements of mil - prf - 38535 and herein. 3.7 certificate of conformance . a certificate of conformance as required for device clas ses q and v in mil - prf -38535 shall be provided with each lot of microcircuits delivered to this drawing.
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 5 dscc form 2234 apr 97 4. verification 4.1 sampling and inspection . for device classes q and v, sampling and inspection procedures shall be in accordance with mil - prf - 38535 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. 4.2 screening . for device classes q and v, screening shall be in accordan ce with mil - prf - 38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2. 1 additional criteria for device classes q and v . a. the burn - in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the burn- in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb ) in accordance with mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified i n method 1015 of mil - std - 883. b. interim and final electrical test parameters shall be as specified in table iia herein. c. additional screening for device class v beyond the requirements of device class q shall be as specified in mil - prf - 38535, a ppendix b. 4.3 qualification inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil - prf - 38535. inspections to be performed shall be those specified in mil- prf - 38535 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for classes q and v shall be in accordance with mil - prf - 38535 including groups a, b, c, d, and e inspections and as specified. 4.4.1 group a inspection . a. tests shall be as specified in table iia herein. b. subgroups 5 and 6 of table i of method 5005 of mil - std - 883 shall be omitted. c. subgroup 4 (c in and c i/o measurements) shall be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. capacitance shall be measured between the designated terminal and gnd at a frequency equal or less than 1 mhz. sample size is 5 devices with no failures, and all input and output terminals tested. d. for device classes q and v, subgroups 7, 8a, and 8b shall include verifying the functionality of the device. 4.4.2 group c inspection . the group c inspect ion end - point electrical parameters shall be as specified in table iia herein. 4.4.2. 1 additional criteria for device classes q and v . the steady - state life test duration, test condition and test temperature, or approved alternatives shall be as specif ied in the device manufacturer's qm plan in accordance with mil - prf - 38535. the test circuit shall be maintained under document revision level control by the device manufacturer's trb in accordance with mil - prf - 38535 and shall be made available to the acqu iring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specif ied in method 1005 of mil - std -883.
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 6 dscc form 2234 apr 97 table i. electrical performance character istics . test symbol conditions -55
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics - continued . test symbol conditions -55
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 8 dscc form 2234 apr 97 table i. electrical performance characteristics - continued . test symbol conditions -55
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 9 dscc form 2234 apr 97 table i. electrical performance characteristics - continued . test symbol conditions -55
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 10 dscc form 2234 apr 97 case y figure 1. case outline .
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 11 dscc form 2234 apr 97 symbol millimeters inches symbol millimeters inches min max min max max min min max a 1.78 2.92 .070 .115 e2 9.40 9.91 .370 .390 b 0.38 0.56 .015 .022 e3 0.76 --- .030 --- b1 0.38 0.48 .015 .019 e 1.27 bsc .050 bsc c 0.10 0.23 .004 .009 l 8.38 8.89 .330 .350 c1 0.10 0.15 .004 .006 m --- 0.04 --- .0015 d 14.99 15.49 .590 .610 q 0.66 1.14 .026 .045 e 12.45 12.95 .490 0510 s1 0.13 --- .005 --- e1 --- 13.20 --- .520 n 24 notes: 1. although dimensions are in inches, the us government preferred system of measurement is the si metric system. however, since this item was originally designed using inch - pound units of measurement, in the event of conflict between the two, the inch - pound units shall take precedence. metric equivalents are for general information only. 2. dimensions d and e1 allow for off - center lid, meniscus, and glass overrun. 3. dimension q shall be measured at the point of exit (beyond the meniscus) of the lead from the bo dy. the minimum shall be reduced by 0.038 mm (0.0015 inch) maximum when solder dip lead finish is applied. 4. dimensions b1 and c1 apply to lead base metal only. dimension m applies to lead plating and finish thickness. the maximum limits of lead dimension s b and c or m shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. measure dimension s1 at all four corners. 6. for bottom - brazed lead packages, no organic or polymeric materials shall be molde d to the bottom or the package to cover the leads. figure 1. case outline - continued .
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 12 dscc form 2234 apr 97 device types all case outlines x,y terminal number terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 a 0 a 1 a 2 a 3 a 4 a 5 a 6 a 7 nc q w gnd e d a 8 a 9 a 10 a 11 a 12 a 13 a 14 a 15 nc v dd figure 2 . terminal connections . read modes mode e w outputs power not selected h x high z standby read l h data out active write l l high z active notes: 1. l = logic low voltage level; h = logic high voltage level; x can be h or l. 2. high z is high impedance state. figure 3 . truth table.
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 13 dscc form 2234 apr 97 read cycle (see note) note: w is high for the entire cycle and d is ignored e is stable prior to a becoming valid and after a becomes invalid . figure 4 . timing waveforms .
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 14 dscc form 2234 apr 97 write cycle 1: w controlled (see note) note: in this mode e rises after w . the address must remain stable whenever both e and w are low . figure 4 . timing waveforms continued.
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 15 dscc form 2234 apr 97 write cycle 2: e controlled figure 4 . timing waveforms continued.
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 16 dscc form 2234 apr 97 4.4.3 group d inspection . the group d inspection end - point electrical parameters shall be as specified in table iia herein. 4.4.4 group e inspection . group e inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end - point electrical parameters shall be as specified in table iia herein. b. for device classes q and v, the devices or test vehicle shall be subjected to radiation har dness assured tests as specified in mil - prf - 38535 for the rha level being tested. all device classes must meet the postirradiation end- point electrical parameter limits as defined in table i at t a = +25c 5c, after exposure, to the subgroups specified in table iia herein. 4.4.4.1 total dose irradiation testing . total dose irradiation testing shall be performed in accordance with mil - std -883 method 1019, condition a and as specified herein. 4.4.4.1.1 accelerated a nnealing test . accelerated a nnealin g tests shall be performed on all devices requiring a rha level greater than 5k rads(si). the post - anneal end- point electrical parameter limits shall be as specified in table i herein and shall be the pre - irradiation end - point electrical parameter limit at 25
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 17 dscc form 2234 apr 97 table iia. electrical test requirements . 1 / 2 / 3 / 4 / 5 / 6 / 7 / line no. test requirements subgroups (in accordance with mil - prf - 38535, table iii) device class q device class v 1 interim electrical parameters (see 4.2) 1, 7, 9 1, 7, 9 2 static burn - in (method 1015) not required required 3 same as line 1 1*, 7*, 9 ? ? ? ?
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 18 dscc form 2234 apr 97 4. 5 delta measurements for device class v . delta measurements, as specified in table iia, shall be made and recorded before and after the required burn - in screens and steady - state life tests to determine delta compliance. the electrical parameters to be measured, with associated delta limits are listed in table iib. the device manufacturer may, at his option, either perform delta measurements or within 24 hours after burn - in perform final electrical parameter tests, subgroups 1, 7, and 9. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil - prf - 38535 for device classes q and v. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 replaceability . m icrocircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform dla land and maritime when a system application requires configurat ion control and which smd's are applicable to that system. dla land and maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dla land and maritime - va, telephone (614) 692- 8108. 6. 4 comments . comments on this drawing should be directed to dla land and maritime - va , columbus, ohio 4321 8 - 399 0, or telephone (614) 692 - 0540 . 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are def ined in mil - prf - 38535 and mil- hdbk -1331. c in ......................................... input terminal capacitance. c i/o ....................................... output terminal capacitance. gnd ....................................... ground zero voltage potential. i dd ......................................... supply current. i i ............................................. input current. i o ........................................... output current. t c .......................................... case temperature. v dd ....................................... positive supply voltage. 6.5.1 timing limits . the table of timing values shows either a minimum or a maximum limit for each parameter. input requirements are specified from the external system point of view. for example, address setup time would be shown as a minimum since the system must supply at least that much time (even though most devices do not require it). on the other hand, responses from the memory are specified from the device point of view. for example, the access time would be shown as a maximum since the device never provides data later than that time.
standard microcircuit drawing size a 5962 - 95822 dla land and maritime columbus, ohio 43218 - 3990 revision level b sheet 19 dscc form 2234 apr 97 6.5.2 waveforms . waveform symbol input output must be valid will be valid change from h to l will change from h to l change from l to h will change from l to h don't care any change permitted changing state unknown high impedance 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device classes q and v are listed in qml -38535 and mil - hdbk -103 . the vendors listed in qml - 38535 have submitted a certificate of compliance (see 3.6 herein) to dla lan d and maritime - va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 13-0 8 -21 approved sources of supply for smd 5962 -9 5822 are listed below for immediate acquisition only and shall be added to mil - hdbk - 103 and qml- 38535 during the next revision. mil- hdbk - 103 and qml- 38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by dla land and maritime - va. this information bulletin is superseded by the next dated revision of mil - hdbk - 103 and qml-38535. dla land and maritime maintains an online data base of all current sources of supply at http://www.landandmaritime.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962f 9 582 2 01qxc 3 / hs 9 -6564 3a rh-q 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed, contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. 3 / not available from an approved source of supply. the last known supplier is listed below. vendor cage vendor name number and address 34371 in tersil corporation 1001 murphy ranch road milpitas, ca 95035 - 6803 1 of 1 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in this information bulletin.

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